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2000, vol.52, no.1	2000, vol.52, no.10	2000, vol.52, no.11	2000, vol.52, no.12	2000, vol.52, no.2	2000, vol.52, no.3
2000, vol.52, no.4	2000, vol.52, no.5	2000, vol.52, no.6	2000, vol.52, no.7	2000, vol.52, no.8	2000, vol.52, no.9

题名	作者	出版年	年卷期
Composition and heat-treatment effects on the adhesion strength of Sn-Zn-Al solders on Cu substrate	Shan-Pu Yu; Hsin-Chien Wang; Min-Hsiung Hon; Moo-Chin Wang	2000	2000, vol.52, no.6
Developing melt-textured YBCO	T. Habisreuther; M. Zeisberger; D. Litzkendorf; O. Surzhenko; W. Gawalek	2000	2000, vol.52, no.6
Dimensionally stable solders for Optoelectronics and microelectronics	Hareesh Mavoori	2000	2000, vol.52, no.6
Dispersion strengthening for dimensional stability in low-melting-point solders	H. Mavoori; S. Jin	2000	2000, vol.52, no.6
JOM-e: magnetic materials in electronic applications	John M. Parsey, Jr.	2000	2000, vol.52, no.6
Manufacturing fifth century B.C. certosa brooches	Maria Rosa Pinasco; Enrica Stagno; Maria Giuseppina Ienco; Paolo Piccardo; Roberto Macellari; Federica Fiori	2000	2000, vol.52, no.6
Recent developments in melt-textured superconductors	Kamel Salama	2000	2000, vol.52, no.6
Recent progress in large-grain REBCO melt texturing	Wai Lo	2000	2000, vol.52, no.6
The creep properties of precipitation strengthened tin-based alloys	Rodney J. McCabe; Morris E. Fine	2000	2000, vol.52, no.6
The properties of melt-textured superconductors	Masato Murakami	2000	2000, vol.52, no.6