中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0913-5685
刊名電子情報通信学会技術研究報告
参考译名电子信息通信学会技术研究报告：元件和材料
收藏年代2000～2024



全部

2000 2001 2002 2013 2015 2020
2021 2022 2023 2024

2000, vol.100, no.141 2000, vol.100, no.271 2000, vol.100, no.272 2000, vol.100, no.320 2000, vol.100, no.371 2000, vol.100, no.395
2000, vol.100, no.396 2000, vol.100, no.485 2000, vol.100, no.486

题名作者出版年年卷期
Introducing a new method that successively extracts circuit from CAD layout to the CAD navigation and its application to failure analysis of system LSIsK. Norimatsu; T. Miyazaki; J. Kinashi; A. Matsuo20002000, vol.100, no.486
Development of an EB/FIB integrated test systemK. Miura; K. Nakamae; H. Fujioka20002000, vol.100, no.486
Layout design for LSI circuit modificationNorio Kuji; Tadao Takeda20002000, vol.100, no.486
Defect portion detection and it's mode classification in CMOS manufacturing process using fault diagnosis technique by I{sub}(DDQ)Masaru Sanada; Kazuo Uehira; Eigo Fuse20002000, vol.100, no.486
Novel nondestructive and non-contact chip inspection and analysis technique: scanning laser-SQUID microscopyK. Nikawa; S. Inoue20002000, vol.100, no.486
Evaluation of the DRAM manufacturing process with wafer-level-CSP technology through simulation analysisM. Tanabe; K. Nakamae; H. Fujioka20002000, vol.100, no.485
A new 3-D packaging technology utilizing jet printing systemTakanari Sasaya; Shinichiro Kawakita; Kazuhiro Turuta; Nobuaki Kawahara20002000, vol.100, no.485
Silicon interposer technology for high-density packageMie Matsuo; Nobuo Hayasaka; Katsuya Okumura; Eiichi Hosomi; Chiaki Takubo20002000, vol.100, no.485
The effect of solder pad metallization on solder fatigue life and crack growth lifeMasazumi Amagai20002000, vol.100, no.485
Sn-Ag solder bump processHirokazu Ezawa; Masahiro Miyata20002000, vol.100, no.485
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