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期刊


ISSN1056-7895
刊名International Journal of Damage Mechanics
参考译名国际破坏力学杂志
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2001, vol.10, no.1 2001, vol.10, no.2 2001, vol.10, no.3 2001, vol.10, no.4

题名作者出版年年卷期
Permeability of WIPP salt during damage evolution and healingKwai S. Chan; Sol R. Bodner; Darrell E. Munson20012001, vol.10, no.4
On an isotropic damage mechanics model for ductile materialsO. Hesebeck20012001, vol.10, no.4
Progressive failure analysis of plain weaves using damage mechanics based constitutive lawsM. Kollegal; S. N. Chatterjee; G. Flanagan20012001, vol.10, no.4
A dynamical systems approach to bifurcation and instability of constitutive relations for brittle damage materialsXin Sun; Dale G. Karr20012001, vol.10, no.4
Acoustic emission analysis for fatigue prediction of lap solder joints in mode two shearBryan J. Van De Wal; Gay Kendall; Bahgat Sammakia; C. Sahay; James Constable20012001, vol.10, no.3
Influence of microstructure coarsening on thermomechanical fatigue behavior of Pb/Sn eutectic solder jointsHong Tang; Cemal Basaran20012001, vol.10, no.3
Damage metric-based mapping approaches for developing accelerated thermal cycling guidelines for electronic packagesRaghuram V. Pucha; James Pyland; Suresh K. Sitaraman20012001, vol.10, no.3
Electric-current induced crack growth in thin films: experimental observations and continuum descriptionAshraf F. Bastawros; Kyung-Suk Kim20012001, vol.10, no.3
Computationally efficient fracture analysis of electronic packages through decompositionDevendra Nateekar; Ganesh Subbarayan20012001, vol.10, no.2
Experimental damage mechanics of microelectronics solder joints under convurrent vibration and thermal loadingCemal Basaran; Alexander Cartwright; Ting Zhao20012001, vol.10, no.2
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