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2001, vol.53, no.1	2001, vol.53, no.10	2001, vol.53, no.11	2001, vol.53, no.12	2001, vol.53, no.2	2001, vol.53, no.3
2001, vol.53, no.4	2001, vol.53, no.5	2001, vol.53, no.6	2001, vol.53, no.7	2001, vol.53, no.8	2001, vol.53, no.9

题名	作者	出版年	年卷期
High temperature lead-free solder for microelectronics	Frank W. Gayle et al.	2001	2001, vol.53, no.6
Creep properties of Sn-Ag solder joints containing intermetallic particles	S. Choi; J. G. Lee; F. Guo; T. R. Bieler; K. N. Subramanian; J. P. Lucas	2001	2001, vol.53, no.6
Pb-free solders for flip-chip interconnects	D. R. Frear; J. W. Jang; J. K. Lin; C. Zhang	2001	2001, vol.53, no.6
Growth of η phase scallops and whiskers in liquid tin-solid copper reaction couples	Robert A. Gagliano; Morris E. Fine	2001	2001, vol.53, no.6
Tin pest in sn-0.5 wt.% Cu lead-free solder	Yoshiharu Kariya; Naomi Williams; Colin gagg; William plumbridge	2001	2001, vol.53, no.6
Copper interconnects for semiconductor devices	Sailesh M. Merchant; Seung H. Kang; Mahesh Sanganeria; Bart van schravendijk; Tom Mountsier	2001	2001, vol.53, no.6
Chemical-mechanical planarization of Cu and Ta	S. V. Babu; Y. Li; A. Jindal	2001	2001, vol.53, no.6
Advances in high-K dielectric gate materials for future ULSI devices	Rajnish K. Sharma; Ashok Kumar; John M. Anthony	2001	2001, vol.53, no.6