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2001, vol.45, no.1	2001, vol.45, no.10	2001, vol.45, no.11	2001, vol.45, no.12	2001, vol.45, no.2	2001, vol.45, no.3
2001, vol.45, no.4	2001, vol.45, no.5	2001, vol.45, no.6	2001, vol.45, no.7	2001, vol.45, no.8	2001, vol.45, no.9

题名	作者	出版年	年卷期
Overview of monitoring methods of manufacturing processes	Toshiroh Shibasaka	2001	2001, vol.45, no.4
Self-adaptive inter-process monitoring - wear monitoring in end milling process-	Takashi Matsumura	2001	2001, vol.45, no.4
Monitoring and prediction of grinding state by use of grinding sound	Shinsaku Hagiwara	2001	2001, vol.45, no.4
Piezoelectric ceramics sensor for monitoring of processing	Tasuku Osada	2001	2001, vol.45, no.4
Ground surface generation process wit super-soft grade resinoid bond wheel	Toshikatsu Nakajima; Kazuhito Ohashi; Noritake Ohkawa; Kazuhiko Nakazawa; Noritomo Tada	2001	2001, vol.45, no.4
Prediction of an ideal surface processing of monocrystalline silicon for minimal surface roughness and damage by molecular dynamics analysis	Hiroaki Tanaka; Shoichi Shimada; Naoya Ikawa	2001	2001, vol.45, no.4
Healing of strength of weakened ground ceramics by heating in electric furnace	Meng Liu; Junichiro-Takagi; Akira Tsukuda	2001	2001, vol.45, no.4
Aspherical grinding by 5 axes control machining center with ELID	Hiroyuki Oguma; Hitoshi Ohmori	2001	2001, vol.45, no.4
Study on high-efficient machining of high-performance quartz oscillators — the 1st report: grinding with grinding ball	Seiichi Yokomizo; Yoshiaki Nagaura	2001	2001, vol.45, no.4