中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2004, vol.4, no.1 2004, vol.4, no.10 2004, vol.4, no.2 2004, vol.4, no.3 2004, vol.4, no.4 2004, vol.4, no.5
2004, vol.4, no.6 2004, vol.4, no.7-8 2004, vol.4, no.9

题名作者出版年年卷期
10 steps to lead-free array package reworkPaul Wood20042004, vol.4, no.1
Higher process temperature is not required to implement lead freeJennie Hwang; Kaihwa Chew; Vincent Kho20042004, vol.4, no.1
Maximizing process control with controlled convection ratesRob DiMatteo; Fred Dimock; Pierre LeMieux20042004, vol.4, no.1
Gold ball bonding on copper substrates at ambient temperaturesI. Lum; N. J. Noolu; Y. Zhou20042004, vol.4, no.1
Secondary reflow failure -another lead contamination defectBob Willis20042004, vol.4, no.1



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