中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1047-4838
刊名JOM
参考译名矿物、金属与材料学会会刊
收藏年代1998~2024



全部

1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2024

2005, vol.57, no.1 2005, vol.57, no.10 2005, vol.57, no.11 2005, vol.57, no.12 2005, vol.57, no.2 2005, vol.57, no.3
2005, vol.57, no.4 2005, vol.57, no.5 2005, vol.57, no.6 2005, vol.57, no.7 2005, vol.57, no.8 2005, vol.57, no.9

题名作者出版年年卷期
Talking with Some Directors of the U.S. National LaboratoriesKelly Roncone20052005, vol.57, no.6
The World is Flat: The Globalization of Materials R&DToni Marechaux; Warren H. Hunt, Jr.20052005, vol.57, no.6
The Drive for Further Miniaturization: Silicon NanoelectronicsN. M. Ravindra20052005, vol.57, no.6
Silicon Nanoelectronics and Beyond: An Overview and Recent DevelopmentsN. M. Ravindra; Vishal R. Mehta; Sudhakar Shet20052005, vol.57, no.6
Rapid Thermal Processing for Silicon Nanoelectronics ApplicationsA. T. Fiory20052005, vol.57, no.6
Vertically Oriented Single-Wall Carbon Nanotube/Enzyme on Silicon as Biosensor ElectrodeYubing Wang; Zafar Iqbal20052005, vol.57, no.6
Solid-Liquid Reactions: The Effect of Cu Content on Sn-Ag-Cu InterconnectsHenry Y. Lu; Haluk Balkan; K. Y. Simon Ng20052005, vol.57, no.6
Solidification Shrinkage Defects in Electronic SoldersGirish S. Wable; Srinivas Chada; Bryan Neal; Raymond A. Fournelle20052005, vol.57, no.6
The Orientation Imaging Microscopy of Lead-Free Sn-Ag Solder JointsA. U. Telang; T. R. Bieler20052005, vol.57, no.6
The Oxidation of Lead-Free Sn Alloys by Electrochemical Reduction AnalysisSungil Cho; Jin Yu; Sung K. Kang; Da-Yuan Shih20052005, vol.57, no.6