中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2005, vol.5, no.1 2005, vol.5, no.10 2005, vol.5, no.2 2005, vol.5, no.3 2005, vol.5, no.4 2005, vol.5, no.5
2005, vol.5, no.6 2005, vol.5, no.7 2005, vol.5, no.8 2005, vol.5, no.9

题名作者出版年年卷期
Printed board assemblies sag during lead-free wave soldering: But they don't have to with good designBob Willis20052005, vol.5, no.3
Practical use of RFID in electronics manufacturingFrancois Monette; Andre Corriveau; Vincent Dubois20052005, vol.5, no.3
Considerations for the procurement of RFID inlay assembly equipmentAlan W. Strassmann20052005, vol.5, no.3
Cleaning implications of lead-free assembly and packaging - part 2Thomas M. Forsythe20052005, vol.5, no.3
Factors influencing tombstonningParminder Singh20052005, vol.5, no.3
PCB manufacturers squeezed from both sides: Spiraling material costs force PCB price increasesHans J. Friedrichkeit20052005, vol.5, no.3



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