中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2006, vol.8, no.1 2006, vol.8, no.2 2006, vol.8, no.3 2006, vol.8, no.4

题名作者出版年年卷期
Advances in Magnetic Current Imaging for Die-Level Fault IsolationS. I. Woods; A. Orozco; L. A. Knauss20062006, vol.8, no.4
On the Effects of Transient Electromagnetic Interference on Integrated CircuitsBernd Deutschmann; Etienne Sicard; Sonia Ben Dhia20062006, vol.8, no.4
What "Green" Means: Challenges for Failure AnalysisBecky Holdford; Roger Stierman20062006, vol.8, no.4
Nanoprobe Failure Analysis of Sub-100 nm CMOS Transistor TechnologiesRandal Mulder; Sam Subramanian; Tony Chrastecky20062006, vol.8, no.4
Can ISTFA Get Us Unstuck?Ingrid De Wolf20062006, vol.8, no.3
ISTFA Comes to Austin, TexasBrennan Davis20062006, vol.8, no.3
ISTFA 2006 - Expanding HorizonsCheryl Hartfield20062006, vol.8, no.3
A Review of the 2006 IEEE International Reliability Physics Symposium Failure Analysis SessionMike Bruce20062006, vol.8, no.3
What Makes a Best Paper? Choosing the ITC 35th Anniversary Significant PapersScott Davidson; Sun Microsystems20062006, vol.8, no.3
What Ever Happened to the Famous CMOS Stuck-Open Fault (aka The Memory Fault)?Victor Champac; Roberto Gomez; Chuck Hawkins20062006, vol.8, no.3
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