中国机械工程学会生产工程分会知识服务平台 | sc.gmachineinfo.com

期刊

全部

2008, vol.29, no.1	2008, vol.29, no.10	2008, vol.29, no.11	2008, vol.29, no.12	2008, vol.29, no.2	2008, vol.29, no.3
2008, vol.29, no.4	2008, vol.29, no.5	2008, vol.29, no.6	2008, vol.29, no.7	2008, vol.29, no.8	2008, vol.29, no.9

题名	作者	出版年	年卷期
Electro-Thermal Behavior of a Sub-Micrometer Bulk CMOS Device: Modeling of Heat Generation and Prediction of Temperatures	TOMOYUKI HATAKEYAMA; KAZUYOSHI FUSHINOBU	2008	2008, vol.29, no.2
Thermo-Mechanical Challenges in Stacked Packaging	DEREJE AGONAFER; ABHIJIT KAISARE; MOHAMMAD M. HOSSAIN; YONGJE LEE; BHAVANI P. DEWAN-SANDUR; TERRY DISHONGH; SENOL PEKIN	2008	2008, vol.29, no.2
Ten Years of Boundary-Condition- Independent Compact Thermal Modeling of Electronic Parts: A Review	CLEMENS J. M. LASANCE	2008	2008, vol.29, no.2
Comparison of Fluid Flow and Thermal Characteristics of Plate-Fin and Pin-Fin Heat Sinks Subject to a Parallel Flow	SUNG JIN KIM; DONG-KWON KIM; HWAN HEE OH	2008	2008, vol.29, no.2
Challenges in Cooling Design of CPU Packages for High-Performance Servers	JIE WEI	2008	2008, vol.29, no.2
A CFD Study on the Effect of Shrinking Box Size on Cooling Airflows in Compact Electronic Equipment - The Case of Portable Projection Display Equipment	LUKE MAGUIRE; WATARU NAKAYAMA; MASUD BEHNIA; YOSHIHIRO KONDO	2008	2008, vol.29, no.2
A Proper Orthogonal Decomposition Based System-Level Thermal Modeling Methodology for Shipboard Power Electronics Cabinets	SYED I. HAIDER; LUDOVIC BURTON; YOGENDRA JOSHI	2008	2008, vol.29, no.2