中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2008, vol.10, no.1 2008, vol.10, no.2 2008, vol.10, no.3 2008, vol.10, no.4

题名作者出版年年卷期
Failure-Analysis Case History-Shorted Winding in MotorStan Silvus20082008, vol.10, no.1
Application of 3-D Transmission Electron Microscopy in Semiconductor Device AnalysisNathan Wang; Susan Li20082008, vol.10, no.1
You Can't Afford to Be a "Moore-On"Ted Dellin20082008, vol.10, no.1
Biannual Face-to-Face EDFAS Board MeetingLee Knauss20082008, vol.10, no.1
Reliability Concepts for Failure AnalystsDavid L. Burgess20082008, vol.10, no.1
Rudolph Ships 100th Wafer Edge and Backside Inspection SystemRosalinda M. Ring20082008, vol.10, no.1
Localization and Analysis of Metal-Coating-Related Electromigration Degradation in the 65 nm Technology NodeEckhard Langer; Moritz Andreas Meyer; Pascal Limbecker; Dirk Utess; Axel Preusse; Oliver Aubel; Steffi Thierbach20082008, vol.10, no.1
Applied Materials Delivers Review at 2 nm ResolutionRosalinda M. Ring20082008, vol.10, no.1
UVision 3 Sets Benchmark for Bright-Field InspectionRosalinda M. Ring20082008, vol.10, no.1
YESTech Introduces Automated Optical Inspection SystemRosalinda M. Ring20082008, vol.10, no.1
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