中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2009, vol.11, no.1 2009, vol.11, no.2 2009, vol.11, no.3 2009, vol.11, no.4

题名作者出版年年卷期
The Box-Pandora's or Schrodinger's?Dick Ross20092009, vol.11, no.4
A Growing Disconnect Between Commercial and High-Reliability ApplicationsChris Henderson20092009, vol.11, no.4
Nanoprobing SRAM Bit Cells with High-Speed PulsesRichard E. Stallcup II; Kanzan Inoue20092009, vol.11, no.4
Magnetic Current Imaging in Failure AnalysisAntonio Orozco20092009, vol.11, no.4
Raman Temperature MeasurementsR. Aaron Falk; Tram Pham20092009, vol.11, no.4
The Changing Face of Nondestructive Failure AnalysisSandra Delgado20092009, vol.11, no.4
Delivering ValueTed Lundquist20092009, vol.11, no.3
FEI Announces New Quanta 50 Series SEMRosalinda M. Ring20092009, vol.11, no.3
Buehler Offers System for Decapsulation of Microelectronic PackagesRosalinda M. Ring20092009, vol.11, no.3
Zeiss Introduces New, Highly Flexible CrossBeam WorkstationRosalinda M. Ring20092009, vol.11, no.3
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