中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2010, vol.12, no.1 2010, vol.12, no.2 2010, vol.12, no.3 2010, vol.12, no.4

题名作者出版年年卷期
Backside Infrared Imaging of Integrated Circuits Using Refraction-Assisted IlluminationStephen LaLumondiere; Terence Yeoh20102010, vol.12, no.4
Parametric Dynamic Laser StimulationKevin Sanchez20102010, vol.12, no.4
Advanced Dynamic Laser-Stimulation Methods Using Lock-In and Mixed-Frequency TechniquesChristof Brillert; Zhongling Qian; Christian Burmer20102010, vol.12, no.4
New Developments in the World of MicroscopyChris Henderson20102010, vol.12, no.4
FEI Introduces Nova NanoSEM 50 SeriesLarry Wagner20102010, vol.12, no.4
Collaboration and Information Sharing Results in Improved Failure Analysis Tools, Techniques, and OutcomesAndrew J. Mawer; William Ng; Michael D. Jackson20102010, vol.12, no.4
Laser-Based Fault Isolation Techniques: Trends of the Last 10 YearsR. Aaron Falk20102010, vol.12, no.3
Combining Refractive Solid Immersion Lens and Pulsed Laser-Induced Technique for Integrated Circuit Failure AnalysisS. H. Goh; A. C. T. Quah; V. K. Ravikumar; S. L. Phoa; V. Narang; J. M. Chin; C. M. Chua; J. C. H. Phang20102010, vol.12, no.3
Understanding the Effects of Local Structures on TIVA Profiles Using Thermal Modeling and SimulationPaiboon Tangyunyong; Edward I. Cole20102010, vol.12, no.3
What's Been Happening with the IVAs?Edward I. Cole20102010, vol.12, no.3
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