中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2011, vol.11, no.1 2011, vol.11, no.10 2011, vol.11, no.11 2011, vol.11, no.2 2011, vol.11, no.3 2011, vol.11, no.4
2011, vol.11, no.5 2011, vol.11, no.6 2011, vol.11, no.7 2011, vol.11, no.8 2011, vol.11, no.9

题名作者出版年年卷期
Thermal management, part 2Joe Fjelstad20112011, vol.11, no.5
Solder paste stencil manufacturing methods & their impact on precision and accuracyAhne Oosterhof20112011, vol.11, no.5
Post-earthquake thoughtsWalt Custer; Jon Custer-Topai20112011, vol.11, no.5
Blind via hole failures - first level FATrevor Galbraith20112011, vol.11, no.5
Rising labor costs in China: Some observations for medical device manufacturersJennifer Read20112011, vol.11, no.5
Enhancing the solder joint reliability of ceramic components for harsh conditionsTrevor Galbraith20112011, vol.11, no.5
Technology focus: Pushing boundaries in selective solderingTrevor Galbraith20112011, vol.11, no.5
X-ray inspection of semiconductor devices that use copper wire interconnectionsDavid Bernard; Evstatin Krastev; Nordson DAGE20112011, vol.11, no.5
Bare board contaminationSheila Hamilton20112011, vol.11, no.5
Are factories efficient?Peter Grundy20112011, vol.11, no.5



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