中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2011, vol.13, no.1 2011, vol.13, no.2 2011, vol.13, no.3 2011, vol.13, no.4

题名作者出版年年卷期
Laser Voltage Imaging: Setting a New Baseline for Circuit AnalysisRoger Nicholson; Ted Lundquist20112011, vol.13, no.3
Variations on FIB in situ Lift-Out for TEM Sample PreparationCheryl Hartfield; Matt Hammer; Gonzalo Amador; Tom Moore20112011, vol.13, no.3
Failure Analysis Tricks and TreatsJason Higgins; Re-Long Chiu; Lisa Daniels; Jessica Wright; Caleb Pedersen20112011, vol.13, no.3
Solutions to Address the Increasing Difficulties of Leading-Edge FAChris Henderson20112011, vol.13, no.3
Innovative Assessment of Thermomechanical Stress Effects in Electronics Components and AssembliesMichael Hertl; Diane Weidmann20112011, vol.13, no.3
The Rise and Fall of New Failure Analysis TechniquesFrank Zachariasse20112011, vol.13, no.3



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