中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2012, vol.14, no.1 2012, vol.14, no.2 2012, vol.14, no.3 2012, vol.14, no.4

题名作者出版年年卷期
Tin Whisker Risk Assessment for Space SystemsMaribeth Mason; Genghmun Eng; Martin Leung; Gary Stupian; Terence Yeoh20122012, vol.14, no.1
ISTFA 2011 Panel Discussion: Finding the "Invisible Defect"Becky Holdford20122012, vol.14, no.1
ISTFA 2011 User's Group 1 - "FIB"Richard H. Livengood; Michael DiBattista20122012, vol.14, no.1
ISTFA 2011 User's Group 2 - "3-D Packaging and Failure Analysis"Gary Liechty; Lihong Cao20122012, vol.14, no.1
ISTFA 2011 User's Group 3 - "Finding the Invisible Defect"Vijay Chowdhury; Jayhoon Chung; Baohua Niu20122012, vol.14, no.1
ISTFA 2011 User's Group 4 - "Nanoprobing and Electrical Characterization"Jake Klein; Lucas Copeland20122012, vol.14, no.1
The Future of Scaling - A Perspective from IEDMChris Henderson20122012, vol.14, no.1
SEM for the 21st Century - Scanning Ion MicroscopyDavid C. Joy20122012, vol.14, no.1
Microscope Created for Next-Generation MicrochipsLarry Wagner20122012, vol.14, no.1
Failure Analysis TrendsLarry Wagner20122012, vol.14, no.1



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