中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2013, vol.13, no.1 2013, vol.13, no.10 2013, vol.13, no.2 2013, vol.13, no.3 2013, vol.13, no.4 2013, vol.13, no.5
2013, vol.13, no.6 2013, vol.13, no.7 2013, vol.13, no.8 2013, vol.13, no.9

题名作者出版年年卷期
The case for automatic profiling: Why it outperforms manualBjorn Dahle20132013, vol.13, no.6
Difficult start to hopefully an improving yearWalt Custer; Jon Custer-Topai20132013, vol.13, no.6
2013 integrated circuit (IC), packaging, and economic outlookSandra Winkler20132013, vol.13, no.6
Anyone for a drink?Craig Hillman20132013, vol.13, no.6
Insulated metal base circuits- Something old, something newJoe Fjelstad20132013, vol.13, no.6
Doing business in India... Background, overview and analysis of India's National Policy on Electronics 2012Sripathy Karur20132013, vol.13, no.6
DfE innovations: very coolHarvey Stone20132013, vol.13, no.6
Fundamental knowledge of solder pasteZhang Ruifen; Reynoso Dexter20132013, vol.13, no.6



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