中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2014, vol.16, no.1 2014, vol.16, no.3 2014, vol.16, no.4

题名作者出版年年卷期
Summary of Peer-Reviewed Literature of Interest to Failure Analysis: Optics, Optical Techniques, and PhotovoltaicsMichael R. Bruce20142014, vol.16, no.4
Unique FIB Application for Mechanical Cross SectioningDoug Hamilton; Phoumra Tan Xilinx20142014, vol.16, no.4
Failure Analysis: Why Mistakes Are Made and How to Avoid Making OneDavid Burgess20142014, vol.16, no.4
Magnetic Current Imaging RevisitedDave Vallett20142014, vol.16, no.4
3-D ICs: Progress Updates, Reliability Concerns, and Failure MechanismsTimothy Lenihan; E. Jan Vardaman; Greg Caswell; Craig Hillman20142014, vol.16, no.4
Contoured Device Sample Preparation for ±5 μm Remaining Silicon Thickness (RST) TolerancesChris Richardson20142014, vol.16, no.4
Are @You Ready For SoBiz?Stephen Lucarini20142014, vol.16, no.3
Yield-Oriented Logic Failure Characterization for FA PrioritizationSzu Huat Goh; Boon Lian Yeoh; Guo Feng You; Jeffrey Lam20142014, vol.16, no.3
Cleaving Breakthrough: A New Method Removes Old LimitationsEfrat Moyal; Ekkehart Brandstadt20142014, vol.16, no.3
Focused Ion Beam (FIB) Circuit EditTaqi Mohiuddin20142014, vol.16, no.3
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