中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2015, vol.17, no.1 2015, vol.17, no.2 2015, vol.17, no.3 2015, vol.17, no.4

题名作者出版年年卷期
DEPOSITING CONTROLLED, MATCHED RESISTORS FOR CIRCUIT EDIT OF ANALOG CIRCUITRYFrank Zachariasse; Harry Roberts; Peter van der Cruijsen20152015, vol.17, no.4
CAPACITORS - THE HELPERS OF ACTIVE DEVICES: A FAILURE ANALYST'S (RE)VIEWPeter Jacob20152015, vol.17, no.4
THE USE OF A VIRTUAL KNOWN GOOD DEVICE (VKGD) TO ACCELERATE 3-D PACKAGING DEVELOPMENTJesse Alton; Martin Igarashi; Ka Chung Lee20152015, vol.17, no.4
DCG SYSTEMS INTRODUCES OPTIFIB TAIPANLarry Wagner20152015, vol.17, no.4
ZEISS ANNOUNCES DCT FOR 3-D MATERIALS SCIENCELarry Wagner20152015, vol.17, no.4
BRUKER INTROCUDES OPTIMUS TKD DETECTORLarry Wagner20152015, vol.17, no.4
OXFORD INSTRUMENTS INTRODUCES GETSTARTED FEATURELarry Wagner20152015, vol.17, no.4
ANASYS INSTRUMENTS PROVIDES NANOSCALE INFRARED SPECTROSCOPYLarry Wagner20152015, vol.17, no.4
3D-MICROMAC OFFERS HIGH-THROUGHPUT MICRODIAGNOSTICSLarry Wagner20152015, vol.17, no.4
THINNING AND POLISHING HIGHLY WARPED DIE: PART IIKirk A. Martin; Nancy Weavers20152015, vol.17, no.4



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