中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2019, vol.21, no.1 2019, vol.21, no.2 2019, vol.21, no.3 2019, vol.21, no.4

题名作者出版年年卷期
MICROSCOPY & MICROANALYSIS 2020 MEETINGFelix Beaudoin20192019, vol.21, no.4
A DEDICATED SYNCHROTRON BEAMLINE SUITE FOR ENHANCED VALIDATION OF INTEGRATED CIRCUITSE. L. Principe20192019, vol.21, no.4
FAILUREANALYSIS: WHO NEEDS IT?George F. Gaut; Dave Burgess20192019, vol.21, no.4
Peer-Reviewed Literature of Interest to Failure Analysis: Proximity and Near-Field TechniquesMichael R. Bruce20192019, vol.21, no.4
ELECTRON CAMERA ENABLES ULTRAFAST SCIENCEFelix Beaudoin20192019, vol.21, no.4
MIP MACHINE EXPANDS DECAPSULATION CAPABILITY FOR FAILURE ANALYSISFelix Beaudoin20192019, vol.21, no.4
THERMAL CAMERAS CAPTURE HEAT DISSIPATION IN 3D INTEGRATED CIRCUITSFelix Beaudoin20192019, vol.21, no.4
ELECTRON MICROSCOPE IMPROVES MAGNETIC MATERIALS IMAGINGTed Kolasa20192019, vol.21, no.4
DIRECTORY OF INDEPENDENT FA PROVIDERSRose M. Ring20192019, vol.21, no.4
EDFAS MEMBERS RECEIVE ASM AWARDFelix Beaudoin20192019, vol.21, no.4
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