中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004~2024



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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2019, vol.21, no.1 2019, vol.21, no.2 2019, vol.21, no.3 2019, vol.21, no.4

题名作者出版年年卷期
MACHINE LEARNING INSIDE THE CELL TO SOLVE COMPLEX FINFET DEFECT MECHANISMS WITH VOLUME SCAN DIAGNOSISManish Sharma; Yan Pan20192019, vol.21, no.1
AN AUTOMATED METHODOLOGY FOR LOGIC CHARACTERIZATION VEHICLE DESIGNZeye Liu; Ben Niewenhuis; Soumya Mittal; Phillip Fynan; R.D. (Shawn) Blanton20192019, vol.21, no.1
ENSURING ADVANCED SEMICONDUCTOR DEVICE RELIABILITY USING FA AND SUBMICRON DEFECT DETECTIONDoug Gray; Dustin Kendig; Andrew A. O. Tay; Ali Shakouri20192019, vol.21, no.1
FUSE BURNOUT DUE TO GATE DRIVE CIRCUIT PARASITIC RINGING IN DC/DC CONVERTERSGuo Xianxin20192019, vol.21, no.1
ISTFA/2018 ISTFA 2018 HIGHLIGHTS All Things Failure Analysis, in Four Impactful DaysEfrat Moyat20192019, vol.21, no.1
ASUMMARY OF THE ISTFA 2018 PANEL DISCUSSION: FAILURES WORTH ANALYZINGSusan X. Li; Renee Parente20192019, vol.21, no.1
ISTFA 2018 FOCUSED ION BEAM (FIB) USER GROUPSteven Herschbein; Michael Wong20192019, vol.21, no.1
ISTFA 2018 SAMPLE PREP USER GROUPJim Colvin20192019, vol.21, no.1
BRUKER LAUNCHES NEW FAMILY OF SCANNING PROBE MICROSCOPESTed Kolasa20192019, vol.21, no.1
COVALENT METROLOGY PARTNERS WITH RIGAKU CORPTed Kolasa20192019, vol.21, no.1
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