中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004~2024



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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2019, vol.21, no.1 2019, vol.21, no.2 2019, vol.21, no.3 2019, vol.21, no.4

题名作者出版年年卷期
THE EVOLUTION OF METROLOGY: FROM LAB TO FABNicholas Antoniou20192019, vol.21, no.2
TIVA MEASUREMENTS WITH VISIBLE AND 1064-nm LASERSPaiboon Tangyunyong; Andrea Rodarte20192019, vol.21, no.2
MEASURING TEMPERATURE IN GaN HEMTs: AN APPROACH BASED ON RAMAN SPECTROSCOPYBertrand Boudart; Yannick Guhel20192019, vol.21, no.2
DATA-DRIVEN RELIABILITY FOR DATACENTER HARD DISK DRIVESAlan Yang; AmirEmad Ghassami; Elyse Rosenbaum; Negar Kiyavash20192019, vol.21, no.2
FAILURE RISK ASSESSMENT OF LASER DIODE STACKS FOR A MARTIAN APPLICATIONGuillaume Thin; Frederic Bourcier; Herve Moisan20192019, vol.21, no.2
THE POWER OF IC REVERSE ENGINEERING FOR HARDWARE TRUST AND ASSURANCEFatemeh Ganji; Domenic Forte; Navid Asadizanjani; Mark Tehranipoor; Damon Woodard20192019, vol.21, no.2
NEW SCRIBING STATION ENABLES CLEAN AND FAST SUBSTRATE DOWNSIZINGTed Kolasa20192019, vol.21, no.2
NEW IMAGING TECHNOLOGY FEATURES HIGH SENSITIVITY FOR FAST ANALYSIS OF FOREIGN MATERIALSFelix Beaudoin20192019, vol.21, no.2
CONDUCTIVE UNDERFILL EPOXYFelix Beaudoin20192019, vol.21, no.2
NEW SOLDER PASTE SUITS MULTIPLE COMPONENT SIZES AND TYPESFelix Beaudoin20192019, vol.21, no.2
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