中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2020, vol.22, no.1 2020, vol.22, no.2 2020, vol.22, no.3

题名作者出版年年卷期
EDFAS: GROWTH IS A CONSTANTFelix Beaudoin20202020, vol.22, no.1
ATOMIC PRECISION ADVANCED MANUFACTURING FOR DIGITAL ELECTRONICSDaniel R. Ward; Scott W. Schmucker; Evan M. Anderson; Ezra Bussmann; Lisa Tracy; Tzu-Ming Lu; Leon N. Maurer; Andrew Baczewski; Deanna M. Campbell; Michael T. Marshall; Shashank Misra20202020, vol.22, no.1
MECHANICAL MILLING AND POLISHING OF CROSS SECTIONS USING A MICRO CNC MACHINE FOR FAILURE ANALYSISPradip Sairam Pichumani; Fauzia Khatkhatay20202020, vol.22, no.1
SCANNING PROBE MICROSCOPY APPLICATIONS IN FAILURE ANALYSIS OF SEMICONDUCTOR DEVICESXiang-Dong Wang20202020, vol.22, no.1
EBOOK PREVIEW STEM-IN-SEM IMAGING TECHNIQUES FOR MICROELECTRONICS FAILURE ANALYSISJason D. Holm; Benjamin W. Caplins20202020, vol.22, no.1
A SUMMARY OF THE ISTFA 2019 PANEL DISCUSSION: WHAT DOES ARTIFICIAL INTELLIGENCE MEAN TO FAILURE ANALYSIS ENGINEERS?Zhigang Song; Christian Schmidt20202020, vol.22, no.1
ISTFA 2019 FOCUSED ION BEAM (FIB) USER GROUPSteven Herschbein; Michael Wong; Mary Coles20202020, vol.22, no.1
ISTFA 2019 CONTACTLESS OPTICAL/NANOPROBING EFA USER GROUPDan Bockelman; Daminda Dahanayaka; Neel Leslie20202020, vol.22, no.1
ISTFA 2019 SYSTEM ON PACKAGE USER GROUPLihong Cao; Prasad Divekar20202020, vol.22, no.1
EDFAS BOARD OF DIRECTORS REPORTRyan Ross20202020, vol.22, no.1
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