中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2020, vol.22, no.1 2020, vol.22, no.2 2020, vol.22, no.3

题名作者出版年年卷期
ARTIFICIAL INTELLIGENCE PROVIDES OPPORTUNITY FOR FAILURE ANALYSISWilliam Hammond; Deepak Goyal20202020, vol.22, no.2
INNOVATIVE PUCK DESIGN FOR THE MECHANICAL CROSS-SECTIONING AND SUBSEQUENT ANALYSIS OF SEMICONDUCTOR PACKAGED SAMPLES IN FAILURE ANALYSISFauzia Khatkhatay; Pradip Sairam Pichumani20202020, vol.22, no.2
A BIOLOGICALLY INSPIRED APPROACH TO INTERCEPTIONFrances S. Chance20202020, vol.22, no.2
COMBINED SCM AND NANOPROBING STUDY OF RESISTIVE FAILS ON SOI FINFET DEVICESLucile C. Teague Sheridan; Don Nedeau20202020, vol.22, no.2
3D HOT-SPOT LOCALIZATION BY LOCK-IN THERMOGRAPHYSebastian Brand; Frank Altmann20202020, vol.22, no.2
ESREF 2019 IN TOULOUSENicolas Nolhier; Guillaume Bascoul20202020, vol.22, no.2
ROAD READY COMPACT PORTABLE TEST SYSTEMTed Kolasa20202020, vol.22, no.2
MULTI-LAYER CERAMIC CAPACITORNicholas Antoniou20202020, vol.22, no.2
VACUUM-RELEASE STORAGE AND SHIPPING BOXESNicholas Antoniou20202020, vol.22, no.2
SUSTAINABLE 3D PRINTED SUPER MAGNETSNicholas Antoniou20202020, vol.22, no.2
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