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期刊
ISSN
1064-2285
刊名
Heat Transfer Research
参考译名
热传导研究
收藏年代
1999~2024
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2021, vol.52, no.1
2021, vol.52, no.10
2021, vol.52, no.11
2021, vol.52, no.12
2021, vol.52, no.13
2021, vol.52, no.14
2021, vol.52, no.15
2021, vol.52, no.16
2021, vol.52, no.17
2021, vol.52, no.18
2021, vol.52, no.2
2021, vol.52, no.3
2021, vol.52, no.4
2021, vol.52, no.5
2021, vol.52, no.6
2021, vol.52, no.7
2021, vol.52, no.8
2021, vol.52, no.9
题名
作者
出版年
年卷期
IMPROVING PERFORMANCE OF THERMOSIPHON USING HYBRID NANOFLUIDS
Kilinc, Cuma
2021
2021, vol.52, no.8
HARDWARE DESIGN FOR CRYOGENIC ETCHING EQUIPMENT
Park, Young-Jun; Du, Hyeon-Cheol; Im, Dong-Hyeok; Hong, Sang Jeen
2021
2021, vol.52, no.8
THERMAL PERFORMANCE IN A PIN FIN-DIMPLE/PROTRUSION DUCT WITH DIFFERENT OPTIMAL OBJECTIVES
Du, Wei; Wang, Chenglong; Luo, Lei; Wang, Songtao; Sunden, Bengt
2021
2021, vol.52, no.8
EXPERIMENTAL INVESTIGATION ON HEAT TRANSFER ENHANCEMENT OF A RADIATOR IN A SIMULATED PEMFC COOLING SYSTEM USING HEXAGONAL BORON NITRIDE NANOFLUIDS
Tao, Qi; Su, Chuqi; Chen, Ming; Deng, Yadong; Wang, Yiping; Li, Jing; Bargal, Mohamed H. S.
2021
2021, vol.52, no.8
ENHANCING BOILING HEAT TRANSFER FOR ELECTRONICS COOLING BY EMBEDDING AN ARRAY OF MICROGROOVES INTO SANDBLASTED SURFACES
Sajjad, Uzair; Sadeghianjahromi, Ali; Wang, Chi-Chuan
2021
2021, vol.52, no.8
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