中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2021, vol.23, no.1 2021, vol.23, no.2 2021, vol.23, no.3

题名作者出版年年卷期
MRAM PRESENTS NEW FACE OF eNVM, AND NEW FA CHALLENGESJoe Versaggi20212021, vol.23, no.1
ENABLING TRUE ROOT CAUSE FAILURE ANALYSIS USING AN ATMOSPHERIC OXYGEN-ONLY PLASMA FOR DECAPSULATION OF ADVANCED PACKAGESLea Heusinger-Jonda; Jiaqi Tang; Kees Beenakker20212021, vol.23, no.1
SPOTLIGHT ON TUTORIALSNicholas Antoniou20212021, vol.23, no.1
APPLIED FAILURE ANALYSIS TOOLS AND TECHNIQUES TOWARD INTEGRATED CIRCUIT TRUST AND ASSURANCEAdam G. Kimura; Adam R. Waite; Jonathan Scholl; Glen D. Via20212021, vol.23, no.1
FINDING SHORTED COMPONENTS ON PRINTED CIRCUIT BOARDS BY INFRARED-BASED DIRECT CURRENT INJECTION METHODZhifeng Zhu; Garron K. Morris20212021, vol.23, no.1
COMPUTATIONAL FAILURE ANALYSIS OF RESISTIVE RAM USED AS A SYNAPSE IN A CONVOLUTION NEURAL NETWORK FOR IMAGE CLASSI FICATIONNagaraj Lakshmana Prabhu; Nagarajan Raghavan Singapore University of Technology and Design20212021, vol.23, no.1
EDFAS AWARD WINNERS: RECOGNIZING INDUSTRY PIONEERS AND LEADERSLee Knauss20212021, vol.23, no.1
ISTFA PROCEEDINGS ADDED TO ASM DIGITAL LIBRARYNicholas Antoniou20212021, vol.23, no.1
EDFAS BOARD OF DIRECTORS REPORTRenee S. Parente20212021, vol.23, no.1
2021 CALL FOR NOMINATIONSLee Knauss20212021, vol.23, no.1
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