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期刊
ISSN
1537-0755
刊名
Electronic Device Failure Analysis
参考译名
电子设备故障分析
收藏年代
2004~2024
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2024
2021, vol.23, no.1
2021, vol.23, no.2
2021, vol.23, no.3
题名
作者
出版年
年卷期
JOIN THE ONLINE COMMUNITY THROUGH CONNECT
Nicholas Antoniou
2021
2021, vol.23, no.2
SECURITY ASSESSMENT OF IC PACKAGING AGAINST OPTICAL ATTACKS
Chengjie Xi; Aslam A. Khan; M. Tanjidur Rahman; Navid Asadizanjani
2021
2021, vol.23, no.2
STATE-OF-THE-ART HIGH-RESOLUTION 3D X-RAY MICROSCOPY FOR IMAGING OF INTEGRATED CIRCUITS
Mirko Holler; Manuel Guizar-Sicairos; Jorg Raabe
2021
2021, vol.23, no.2
TEM STUDY OF OXYGEN PARTIAL PRESSURE EFFECT ON EARLY LSM-YSZ SURFACE INTERACTIONS IN SOLID OXIDE FUEL CELLS
H. J. Wang; M. Chen; Y. L. Liu; L. Theil Kuhn; J. R. Bowen
2021
2021, vol.23, no.2
EDFAS USER GROUP SERIES 2021 HIGHLIGHTS
Tejinder Gandhi; Anita Madan; Ted Kolasa; EDFA User Group Co-Chairs
2021
2021, vol.23, no.2
FOCUSED ION BEAM (FIB) VIRTUAL USER GROUP
Steven Herschbein; Michael Wong; Valerie Brogden
2021
2021, vol.23, no.2
SAMPLE PREP VIRTUAL USER GROUP
Jim Colvin; Bryan Tracy
2021
2021, vol.23, no.2
CONTACTLESS PROBING AND NANOPROBING VIRTUAL USER GROUP
Dan Bockleman; Daminda Dahanayaka; Neel Leslie; Sara Ostrowski
2021
2021, vol.23, no.2
SYSTEM ON PACKAGE VIRTUAL USER GROUP
Prasad Divekar; Kevin Distelhurst
2021
2021, vol.23, no.2
ARTIFACT-FREE CROSS SECTIONING OF HIGH ASPECT RATIO ETCH CAVITIES USING INK
Travis Mitchell; Brian Popielarski; Frieder Baumann
2021
2021, vol.23, no.2
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