中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2022, vol.24, no.1 2022, vol.24, no.2

题名作者出版年年卷期
ISTFA DURING THE PANDEMICNicholas Antoniou20222022, vol.24, no.1
DETERMINATION OF INDENTER CRACK PROBABILITY ON MULTILAYER STACKS USING AN ACOUSTIC EMISSION TEST METHODMarianne Unterreitmeier; Oliver Nagler20222022, vol.24, no.1
OPTIMAL SAMPLING AND RECONSTRUCTION STRATEGIES FOR SCANNING MICROSCOPESNigel D. Browning; Daniel Nicholls; Jack Wells; Alex W. Robinson20222022, vol.24, no.1
SIMULTANEOUS LOCAL CAPACITANCE-VOLTAGE PROFILING AND DEEP LEVEL TRANSIENT SPECTROSCOPY USING TIME-RESOLVED SCANNING NONLINEAR DIELECTRIC MICROSCOPYYasuo Cho20222022, vol.24, no.1
SCANNING NITROGEN VACANCY MAGNETOMETRY: A QUANTUM TECHNOLOGY FOR DEVICE FAILURE ANALYSISPeter Rickhaus; Patrick Maletinsky20222022, vol.24, no.1
ISTFA/2021 ISTFA 2021 HIGHLIGHTSSusan Li20222022, vol.24, no.1
A SUMMARY OF THE ISTFA 2021 PANEL DISCUSSION: OVERCOMING THE CHALLENGES IN SYSTEM-IN-PACKAGE FAILURE ANALYSISYan Li; Randy Mulder; Greg Johnson20222022, vol.24, no.1
ISTFA 2021 USER GROUP HIGHLIGHTSAnita Madan; Daminda Dahanayaka20222022, vol.24, no.1
ISTFA 2021 SAMPLE PREP USER GROUPJim Colvin; Cecile Bonifacio; Kah Chin Cheong; Nathan Bakken20222022, vol.24, no.1
ISTFA 2021 SYSTEM ON PACKAGE USER GROUPLihong Cao; Kevin Distelhurst; Wentao Qin20222022, vol.24, no.1
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