中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0925-1030
刊名Analog Integrated Circuits and Signal Processing
参考译名模拟集成电路与信号处理
收藏年代2000~2024



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2000 2001 2002 2003 2004 2005
2006 2007 2008 2009 2010 2011
2012 2013 2014 2015 2016 2017
2018 2019 2020 2021 2022 2023
2024

2023, vol.114, no.1 2023, vol.114, no.2 2023, vol.114, no.3 2023, vol.115, no.1 2023, vol.115, no.2 2023, vol.115, no.3
2023, vol.116, no.1/2 2023, vol.116, no.3 2023, vol.117, no.1/3

题名作者出版年年卷期
Low-cost defect simulation framework for analog and mixed signal (AMS) circuits with enhanced time-efficiencySaikiran Marampally; Sekyere Michael; Ganji Mona; Yang Ruohan; Chen Degang20232023, vol.117, no.1/3
VVC decoder intra prediction using approximate storage: an error resilience evaluationIsquierdo Matheus; Soares Renira; Sampaio Felipe; Zatt Bruno; Palomino Daniel20232023, vol.117, no.1/3
Capacitance-to-digital converter in dual-mode logic: power consumption vs conversion time trade-offAiello Orazio; Crovetti Paolo20232023, vol.117, no.1/3
Active and passive rectification methods for US-powered IMDsBallo Andrea; Grasso Alfio Dario; Privitera Marco20232023, vol.117, no.1/3
Chronos-v: a many-core high-level model with support for management techniquesWeber Ia?an? Ianiski; Dal Zotto Angelo Elias; Moraes Fernando Gehm20232023, vol.117, no.1/3
BTI aging-based physical cloning attack on SRAM PUF and the countermeasureDuan Shengyu; Sai Gaole20232023, vol.117, no.1/3
RF neuromorphic spiking sensor for smart IoT devicesJouni Zalfa; Soupizet Thomas; Wang Siqi; Benlarbi-Delai Aziz; Ferreira Pietro M.20232023, vol.117, no.1/3
SBCCI 2022 special issueAgostini Luciano Volcan; Azambuja Jose Rodrigo20232023, vol.117, no.1/3
A novel design of an ultra-low-cost (m?×?n) multilayer RAM structure in quantum-dot cellular automata nanotechnologyKassa Sankit Ramkrishna; Ambudkar Bhavna; Gupta Prateek; Pattanayak Himansu Sekhar; Kumar Manoj20232023, vol.116, no.3
Infrared image segmentation for circuit board based on active contour and fuzzy clusteringJi Meiling; Zeng Peipei; Liu Yongsheng20232023, vol.116, no.3
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