中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2023, vol.25, no.1 2023, vol.25, no.2 2023, vol.25, no.3 2023, vol.25, no.4

题名作者出版年年卷期
THE REVITALIZATION OF THE EDFAS LONESTAR CHAPTERJoe Caroselli; Renee Parente; Tom Schamp20232023, vol.25, no.1
MAKING CONNECTIONS: CHALLENGES AND OPPORTUNITIES FOR IN SITU TEM BIASINGWilliam A. Hubbard20232023, vol.25, no.1
SCANNING MICROWAVE IMPEDANCE MICROSCOPY: OVERVIEW AND LOW TEMPERATURE OPERATIONNicholas Antoniou20232023, vol.25, no.1
PROCESSES FOR THINNING AND POLISHING HIGHLY WARPED DIE TO A NEARLY CONSISTENT THICKNESS: PART IIKirk A. Martin20232023, vol.25, no.1
TRANSFORMING AN INDUSTRY: AN INVENTOR'S TALE OF FIB IN SITU LIFT-OUTCheryl Hartfield20232023, vol.25, no.1
ISTFA 2022 HIGHLIGHTSZhigang Song20232023, vol.25, no.1
A SUMMARY OF THE ISTFA 2022 PANEL DISCUSSION: IS OUR FUTURE FA IDENTIFYING/ISOLATING ELUSIVE AND INTRIGUING DEFECTS?Erwin Hendarto; Anita Madan; Steven Herschbein20232023, vol.25, no.1
ISTFA 2022 USER GROUP HIGHLIGHTSKeith Serrels; Daminda Dahanayaka20232023, vol.25, no.1
ISTFA 2022 OPTICAL FAULT ISOLATION, TEST, AND DIAGNOSIS USER GROUPDan Bockelman; Neel Leslie; Kevin Distelhurst20232023, vol.25, no.1
ISTFA 2022 NANOPROBING USER GROUPGreg Johnson; Nicholas Antoniou20232023, vol.25, no.1
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