中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2024, vol.26, no.1 2024, vol.26, no.2 2024, vol.26, no.3

题名作者出版年年卷期
GUEST EDITORIAL: DEMAND FOR AI COMPUTING WILL SHAPE FA COMMUNITYJames Chambers20242024, vol.26, no.3
NONDESTRUCTIVE DEFECT DETECTION IN 3D X-RAY MICROSCOPY DATA OF BALL GRID ARRAY SOLDER FOR VOID DETECTION IN SOLDER JOINTS USING DEEP LEARNINGKishansinh Rathod; Sankeerth Desapogu; Andreas Jansche; Timo Bernthaler; Daniel Braun; Stephan Diez; Gerhard Schneider20242024, vol.26, no.3
ESREF 2024anonymous20242024, vol.26, no.3
ITC 2024anonymous20242024, vol.26, no.3
ASSESSING COMPATIBILITY OF ADVANCED IC PACKAGES TO X-RAY BASED PHYSICAL INSPECTIONM. Shafkat M. Khan; Chengjie Xi; Nitin Varshney; Aslam A. Khan; Hamed Dalir; Navid Asadizanjani; KJ Johanns20242024, vol.26, no.3
RELIABILITY AND OPTIMIZATION OF WIRE BONDING IN POWER MICROELECTRONIC DEVICESNorelislam El Hami; Aicha Koulou; Abdelkhalak El Hami20242024, vol.26, no.3
NANOTS 2024anonymous20242024, vol.26, no.3
ISTFA 2024 PREVIEW: 50TH ANNIVERSARYYan Li20242024, vol.26, no.3
EDFAS 2024 PHOTO CONTESTanonymous20242024, vol.26, no.3
EDUCATION NEWS: SPOTLIGHT ON TUTORIALSBhanu P. Sood20242024, vol.26, no.3
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