中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2025

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024 2025

2025, vol.25, no.1 2025, vol.25, no.2 2025, vol.25, no.3 2025, vol.25, no.4 2025, vol.25, no.5 2025, vol.25, no.6
2025, vol.25, no.7 2025, vol.25, no.8

题名作者出版年年卷期
productronica Provides Much-Needed Industry Boost!Trevor Galbraith20252025, vol.25, no.8
AMERICAS REPORTanonymous20252025, vol.25, no.8
EUROPE REPORTanonymous20252025, vol.25, no.8
ASIA REPORTanonymous20252025, vol.25, no.8
ADVANCED PACKAGINGanonymous20252025, vol.25, no.8
Best productronica Ever' (probably!)KEITH BRYANT20252025, vol.25, no.8
KONIG Pioneers 3D Digital Packaging Solutions for the Electronics IndustryWENDY XU; Gavin Peterson20252025, vol.25, no.8
Measurlabs Helps Semiconductor Companies Get More Accurate Analyses for Every NeedFANNY TORNQVIST20252025, vol.25, no.8
Sinergo Power Semiconductor Module Production and Power Boards AssemblyELISA BUSO20252025, vol.25, no.8
How a Virtual Twin Turns Tariff Turbulence into a Strategic Advantage for ManufacturersMATT HARTLEY20252025, vol.25, no.8
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