中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2026



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024 2025 2026

2025, vol.27, no.1 2025, vol.27, no.2 2025, vol.27, no.3 2025, vol.27, no.4

题名作者出版年年卷期
GUEST EDITORIAL: CHIPLET ARCHITECTURES: ENABLING SCALABLE INTEGRATION FOR THE AI ERARaja Swaminathan20252025, vol.27, no.4
INNOVATIVE THERMAL APPROACHES TO FAULT ISOLATION IN THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURESNorimichi Chinone; Shimpei Tominaga20252025, vol.27, no.4
AVOIDING SEM-INDUCED DEVICE DEGRADATION THROUGH SEMI-BLIND NANOPROBINGMarc Heinemann; Markus Reichel20252025, vol.27, no.4
NOTEWORTHY NEWS: NANOTS 2025anonymous20252025, vol.27, no.4
TOWARD A FAILURE ANALYSIS CHATBOT WITH RETRIEVAL-AUGMENTED GENERATIONMaik Fichtenkamm; Markus Kofler; Konstantin Schekotihin; Christian Burmer20252025, vol.27, no.4
CAM WORKSHOP SUMMARY: CAM WORKSHOP: NEW APPROACHES FOR FAILURE ANALYSIS AND MATERIAL DIAGNOSTICS OF ELECTRONIC COMPONENTSMichael DiBattista20252025, vol.27, no.4
EDFAS AWARDSanonymous20252025, vol.27, no.4
NOTEWORTHY NEWS: IEDM 2025anonymous20252025, vol.27, no.4
EDFAS MEMBERS RECEIVE ASM AWARDSanonymous20252025, vol.27, no.4
NOTEWORTHY NEWS: IRPS 2026anonymous20252025, vol.27, no.4
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