中国机械工程学会生产工程分会知识服务平台 | sc.gmachineinfo.com

会议文集

会议名	60th Annual Microelectronics and Packaging Conference and Exhibition (NordPac 2024)
中译名	《第六十届微电子与封装年会暨展览会》
机构	International Microelectronics and Packaging Society (IMAPS)
会议日期	11-13 June 2024
会议地点	Tampere, Finland
出版年	2024
馆藏号	353087

题名	作者	出版年
3D ceramic packaging; a solution to high-density device integration at harsh environments	Khashayar Khazen; Pascal Metayer	2024
Direct copper interconnection: laser direct structuring and morphological characterization of copper plated vias	Alessandro Mellina Gottardo; Claudio Zafferoni; Riccardo Villa	2024
Accelerate and optimize your packaging using large-scale multiphysics simulations in your browser	Rahul Nagaraja; Abhishek Deshmukh; Bassou Khouya; Jonni Lohi; Mika Lyly; Janne Ruuskanen; Alexandre Halbach	2024
Molding Process Simulation and Viscoelastic Model for Package Warpage Anticipation	Marco Rovitto	2024
Development of a Non-contact Jet Dispensing of Liquid Metals	Jan Maslik; Gustaf Martensson; Alessandro Gumiero; Elio Cometti; Klas Hjort	2024
LTCC Back-scattered Polarization Duplexing Chipless RFID for Nearfield Interrogation	Enrico Tolin; Achim Bahr; Andreas Wien; Peter Uhlig	2024
Anti-biofouling PCL-based Polyurethane Permselective Film Packaging for Dopamine-sensing Brain Implant	Stefanus Wirdatmadja; Vijay Singh Parihar; Lauri Sydanheimo; Merja Voutilainen; Minna Kellomaki; Leena Ukkonen	2024
Optically pumped magnetometer arrays for magnetoencephalography (OPMMEG)	Markku Lahti	2024
Advanced Nano Packaging for Silicon Nanowire Sensors	Thambiraj Selvarathinam; Bruce Kim; Jeong H. Lee; Jong W. Park	2024
Introduction of Digital System-In-Package building block for space applications	Hugo Garcia; Helene Jochem; Norbert Venet; Mirko Rocci; Andres Matias Dabas; Luca Sollecchia; Poul Juul; Kim Ankeraa; Monique Mayr; Paolo Scalmati; Giovanni Cucinella	2024
Biodegradable and water-soluble DEG1 substrate for Printed Circuit Board applications	Hajdu Istvan; Hamadeh Amir; Lajter Peter Tamas; Geczy Attila	2024
Simultaneous Modeling of Swelling and Heat Transfer in Polymers	Stefan Wagner; Mario Gschwandl; Roland Nagl; Michael Fischlschweiger; Tim Zeiner	2024
Monolithic Fabrication of On-Paper Self-Charging Power Systems Through Direct Ink Writing	Yingchun Su; Yujie Fu; Shiqian Chen; Zheng Li; Han Xue; Jiantong Li	2024
A Simulation Based Comparative Study on Thermal and Mechanical Performance of Silicone Grease and Graphene-enhanced Thermal Pad for Single-chip and Multi-chip Packaging Applications	Jiabin Chen; Yunzheng Xuan; Yiran Liu; Jin Chen; Yuanyuan Wang; Johan Moller; Johan Liu	2024
PurPest - developing a sensor system prototype for detecting pests in plants	Daniel Nilsen Wright; Andrea Ficke	2024
Integration of a Miniature Multichannel Laser Diode Chip to a Silicon Photonics Integrated Circuit Using Laser-Assisted Bonding	Aleksandr Vlasov; Santeri Lehtinen; Evgenii Lepukhov; Heikki Virtanen; Samu-Pekka Ojanen; Jukka Viheriala; Mircea Guina	2024
Advancements in Microelectronic and Optoelectronic Packaging: Novel Approaches for Enhanced Performance and Reliability	Giovanni Zafarana; Luca Mauri; Enea Rizzi; Alessio Corazza	2024
Sodium silicate as an enabler for wafer bonding of glass substrates and lids	Parnika Gupta; Joseph O' Brien; Jun Su Lee; How Yuan Hwang; Kamil Gradkowski; Padraic E. Morrissey; Peter O'Brien	2024
Assembly of optical micro-ring resonator-based ultrasound sensor for photoacoustic imaging	Evgenii Lepukhov; Aleksandr Vlasov; Santhosh Pandian; Rainer Hainberger; Paul Mullner; Moritz Eggeling; Tapio Niemi	2024
Co-Integration of microelectronics and photonics in novel sensor	Firehun Dullo; Daniel Wright; Christopher Dirdal; Marco Povoli; Anneriudh Sundararajan; Milan Milosevic	2024