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issn1005-0302
刊名材料科学技术学报：英文版
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2022 2023

vol.01 vol.02 vol.03 vol.04 vol.05 vol.06
vol.07 vol.08 vol.09 vol.10 vol.11 vol.12
vol.13 vol.14 vol.15 vol.16 vol.17 vol.18
vol.19 vol.20 vol.21 vol.22 vol.23 vol.24

题名刊名作者出版年年卷期
Strong, lightweight, and highly conductive CNT/Au/Cu wires from sputtering and electroplating methods材料科学技术:英文版Thang Q.Tran;Jeremy Kong Yoong Lee;Amutha Chinnappan;W.A.D.M.Jayathilaka;Dongxiao Ji;Vishnu Vijay Kumar;Seeram Ramakrishna20205
Low contact resistivity and long-term thermal stability of Nb0.8Ti0.2FeSb/Ti thermoelectric junction材料科学技术:英文版Zhijie Huang;Li Yin;Chaoliang Hu;Jiajun Shen;Tiejun Zhu;Qian Zhang;Kaiyang Xia;Jiazhan Xin;Xinbing Zhao20205
Atomic-scale investigation of spinel Li Fe5O8 thin films on SrTiO3(001) substrates材料科学技术:英文版Kun Liu;Ruyi Zhang;Lu Lu;Shaobo Mi;Ming Liu;Hong Wang;Shengqiang Wu;Chunlin Jia20205
Plastic deformation behavior of a nickel-based superalloy on the mesoscopic scale材料科学技术:英文版Qiang Zhu;Chuanjie Wang;Kai Yang;Gang Chen;Heyong Qin;Peng Zhang20205
Effect of strain rate on plastic deformation bonding behavior of Ni-based superalloys材料科学技术:英文版Jian Yang Zhang;Bin Xu;Naeem ul Haq Tariq;Ming Yue Sun;Dian Zhong Li;Yi Yi Li20205
Novel insight into dry sliding behavior of Cu-Pb-Sn in-situ composite with secondary phase in different morphology材料科学技术:英文版B.W.Dong;S.H.Wang;Z.Z.Dong;J.C.Jie;T.M.Wang;T.J.Li20205
Primary dendrite growth kinetics and rapid solidification mechanism of highly undercooled Ti-Al alloys材料科学技术:英文版Z.C.Luo;H.P.Wang20205
Enhancing the bake-hardening responses of a pre-aged Al-Mg-Si alloy by trace Sn additions材料科学技术:英文版Gang Lu;Shuai Nie;Jianjun Wang;Ying Zhang;Tianhai Wu;Yujie Liu;Chunming Liu20205
Microstructure and stress corrosion cracking of a SA508-309L/308L-316L dissimilar metal weld joint in primary pressurized water reactor environment材料科学技术:英文版Lijin Dong;Cheng Ma;Qunjia Peng;En-Hou Han;Wei Ke20205
Effect of atomic structure on preferential oxidation of alloys:amorphous versus crystalline Cu-Zr材料科学技术:英文版Yifei Xu;Lars P.H.Jeurgens;Peter Schützendübe;Shengli Zhu;Yuan Huang;Yongchang Liu;Zumin Wang20205
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