中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0547-051X
刊名NEC Research & Development
参考译名日本电气公司研究与发展
收藏年代1999～2003

关联期刊参考译名收藏年代
NEC Technical Journal日本电气公司技报2006～2009
NEC Journal of Advanced Technology日本电气公司研究与发展2004～2005


全部

1999 2000 2001 2002 2003

2003, vol.44, no.1 2003, vol.44, no.2 2003, vol.44, no.3 2003, vol.44, no.4

题名作者出版年年卷期
High-performance FCBGA based on multi-layer thin-substrate packaging technologyTadanori Shimoto; Katsumi Kikuchi; Kazuhiro Baba; Koji Matsui; Hirokazu Honda; Keiichiro Kata20032003, vol.44, no.3
Micro-bump formation technology for flip-chip LSIs using micro-solder-ballIchiro Hazeyama20032003, vol.44, no.3
New flip chip technology using gold-bumped chip with pre-coated adhesive resinTakashi Miyazaki; Rieka Yoshino; Keiichiro Kata20032003, vol.44, no.3
Development of CoC (chip-0n-chip) interconnection technology in hyperfine pitchTomohiro Nishiyama; Masamoto Tago; Seiya Isozaki; Yoshiaki Morishita20032003, vol.44, no.3
Real chip size 3-dimensional-stacked packageTakao Yamazaki; Rieka Yoshino; Keiichiro Kata; Yoshimichi Sogawa; Ichiro Hazeyama; Sakae Kitajo20032003, vol.44, no.3
Development of a system for measuring high-frequency magnetic fields and currents of LSIs and PCBsNorio Masuda; Naoya Tamaki; Toshihide Kuriyama; Takeshi Watanabe; Toshiki Shimasaki; Yoshihiro Shiratori20032003, vol.44, no.3
Thermal fatigue mechanisms of CSP solder joints on PWBHironori Ohta; Nozomu Nishimura20032003, vol.44, no.3
Delamination by reheating in SMD solder joint using lead-free solderYuki Momokawa; Naomi Ishizuka20032003, vol.44, no.3
Development of environmentally safe flame-retarding epoxy resin compounds without halogen and phosphorous derivatives and their application to printed wiring boardsYukihiro Kiuchi; Masatoshi Iji20032003, vol.44, no.3
An introduction to quantum information technologyKazuo Nakamura20032003, vol.44, no.3
12



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  京公网安备11010202008970号  机械工业信息研究院 2018-2024