中国机械工程学会生产工程分会知识服务平台

期刊


刊名Flexible and Printed Electronics
参考译名柔性和印刷电子学
收藏年代2019～2024



全部

2019 2020 2021 2022 2023 2024


题名作者出版年年卷期
In-sensor computing using Ti_3C_2T_x MXene memristor crossbar arrays for wearable electronicsJeny Gosai; Mansi Patel; Anjalee Gosai; Nitin Chaudhari; Ankur Solanki20242024, vol.9, no.4
Printed hybrid capacitive Kirigami sensor: enhancing flexibility and conformability for improved motion artifactsLaura Morelli; Arjun Wadhwa; Sylvain Cloutier; Martin Bolduc; Ghyslain Gagnon; Ricardo J Zednik20242024, vol.9, no.4
A compact multiband flexible antenna with a full ground plane for off body communicationA Praveena; GUmamaheswari; G Dhayanithi; Jayant Kumar Rai; Pinku Ranjan20242024, vol.9, no.4
Inkjet printing of sustainable ZTO/AlO_x thin film transistorsPedro Gabriel Moreira; Rodrigo Martins; Emanuel Carlos; Rita Branquinho20242024, vol.9, no.4
Sintering of copper nanoparticles using intense pulsed light for screen-printed films on flexible substrateManoranjan; Ashish Gupta; Y N Mohapatra20242024, vol.9, no.4
Nanoscale sintering of zinc micropowders for high conductivity and sensing applications of transient electronicsZuzanna Pamula; Marcin Sloma20242024, vol.9, no.4
Conformally printed additively manufactured RF demonstrator for circuit compactionAndrew Luce; Christopher Areias; Susan Trulli; Elicia Harper; Yiwen Zhang; Guinevere Strack; John Lovaasen; Alkim Akyurtlu20242024, vol.9, no.4
Living hinges for resilient and recyclable paper-based flexible printed electronicsFlora Wu; Neil Graddage; James Lee; Ryan Griffin20242024, vol.9, no.4
Stretchable printed circuit boards using a silicone substrate of variable stiffness and conventional PCB fabrication methodsArmin Jamali; Christoph Lehmann; Ravi Teja Aditya; Frank Goldschmidtboeing; Peter Woias; Laura M Comella20242024, vol.9, no.4
Fabrication and electrical properties of flexible polymer-based MIM capacitors of high-k nanolaminate dielectrics of HfO_2-SnO_2-TiO_2 with ultrathin Al_2O_3 insertion layer by plasma-enhanced atomic layer depositionChu-Yi Zhang; Chen Wang; Li Gao; Chang Fang; Lin Zhu; Wei-Min Li; Di Wu; Ai-Dong Li20242024, vol.9, no.4
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