中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0013-4686
刊名Electrochimica Acta
参考译名国际电化学杂志：电化学学报
收藏年代1998～2024



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1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
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2001, vol.46, no.10-11 2001, vol.46, no.12 2001, vol.46, no.13-14 2001, vol.46, no.15 2001, vol.46, no.16 2001, vol.46, no.17
2001, vol.46, no.18 2001, vol.46, no.19 2001, vol.46, no.20-21 2001, vol.46, no.22 2001, vol.46, no.23 2001, vol.46, no.24-25
2001, vol.46, no.26-27 2001, vol.46, no.28 2001, vol.46, no.6 2001, vol.46, no.7 2001, vol.46, no.8 2001, vol.46, no.9
2001, vol.46. no.13-14 2001, vol.47, no.1-2 2001, vol.47, no.3 2001, vol.47, no.4 2001, vol.47, no.5 2001, vol.47, no.6

题名作者出版年年卷期
Principles of electrochemical micro- and nano-system technologiesJoachim Walter Schultze; Arnd Bressel20012001, vol.47, no.1-2
Introduction of electrochemical microsystem technologies (EMT) from ultra-high-density magnetic recordingTetsuya Osaka20012001, vol.47, no.1-2
Hydrodynamic ultramicroelectrodes: kinetic and analytical applicationsJulie V. Macpherson; Nafeesa Simjee; Patrick R. Unwin20012001, vol.47, no.1-2
Molecular orbital study on the reaction mechanisms of electroless deposition processesTakayuki Homma; Isao Komatsu; Amiko Tamaki; Hiromi Nakai; Tetsuya Osaka20012001, vol.47, no.1-2
Material characterisation of electroplated nickel structures for microsystem technologyT. Fritz; W. Mokwa; U. Schnakenberg20012001, vol.47, no.1-2
Pulse reversal plating of nickel and nickel alloys for microgalvanicsPeter T. Tang20012001, vol.47, no.1-2
Microstructure in electrodeposited copper layers: the role of the substrateAnette A. Rasmussen; Jens A. D. Jensen; Andy Horsewell; Marcel A. J. Somers20012001, vol.47, no.1-2
Plating technology for electronics packagingHideo Honma20012001, vol.47, no.1-2
Via-filling using electroplating for build-up PCBsTakeshi Kobayashi; Junichi Kawasaki; Kuniaki Mihara; Hideo Honma20012001, vol.47, no.1-2
Optimisation of a cupplater reactor for gold deposition on wafersD. de Kubber; L. Bortels; J. Deconinck; T. E. G. Daenen20012001, vol.47, no.1-2
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