中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0013-4686
刊名Electrochimica Acta
参考译名国际电化学杂志:电化学学报
收藏年代1998~2024



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2008, vol.53, no.10 2008, vol.53, no.11 2008, vol.53, no.12 2008, vol.53, no.13 2008, vol.53, no.14 2008, vol.53, no.15
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2008, vol.53, no.22 2008, vol.53, no.23 2008, vol.53, no.24 2008, vol.53, no.25 2008, vol.53, no.26 2008, vol.53, no.27
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2008, vol.54, no.1 2008, vol.54, no.2

题名作者出版年年卷期
Stereospecificity in redox reactions of catechins at gold electrodes modified with self-assembled monolayers of homocysteineTakuya Nakanishi; Mariko Matsunaga; Makoto Nagasaka; Tsubasa Ueno; Tetsuya Osaka20082008, vol.53, no.21
Electrodeposition of Ru by atomic layer deposition (ALD)Chandra Thambidurai; Youn-Geun Kim; John L. Stickney20082008, vol.53, no.21
Apparent electrocatalysis on 3D nanoporous platinum film electroplated from hexagonal lyotropic liquid crystalline phase of Triton X-100Sejin Park; Hankil Boo; Sun Young Lee; Hyun-Mi Kim; Ki-Bum Kim; Hee Chan Kim; Taek Dong Chung20082008, vol.53, no.21
Electronic interactions decreasing the activation barrier for the hydrogen electro-oxidation reactionElizabeth Santos; Wolfgang Schmickler20082008, vol.53, no.21
On the contribution of electrostriction to charge-induced stresses in anodic oxide filmsJ.-F. Vanhumbeeck; J. Proost20082008, vol.53, no.21
Hydrophilicity transition of the clean rutile TiO{sub}2 (110) surfaceDaniel C. Hennessy; Michael Pierce; Kee-Chul Chang; Satoru Takakusagi; Hoydoo You; Kohei Uosaki20082008, vol.53, no.21
Inducing enantioselectivity in electrodeposited CuO films by chiral etchingShaibal K. Sarkar; Niharika Burla; Eric W. Bohannan; Jay A. Switzer20082008, vol.53, no.21
In situ EC-STM studies of n-Si(111):H in 40% NH4F solution at pH 10Sang-Eun Bae; Jung-Hyun Yoon; Chi-Woo J. Lee; Il Cheol Jeon20082008, vol.53, no.21
Electrodeposition of ZnSeRemigiusz Kowalik; Piotr Zabinski; Krzysztof Fitzner20082008, vol.53, no.21
Shape and size stability of Pt nanoparticles for MeOH electro-oxidationCeren Susut; Thuy D. Nguyen; George B. Chapman; YuYe Tong20082008, vol.53, no.21
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