中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0370-985X
刊名銅と銅合金
参考译名铜与铜合金
收藏年代1998～2006

关联期刊参考译名收藏年代
伸銅技術研究会誌黄铜技术研究会志 


全部

1998 1999 2000 2001 2002 2003
2006

2000, vol.39, no.1

题名作者出版年年卷期
Adhesion of resin to copper-zinc alloyTakeo Uno; Masaaki Kurihara20002000, vol.39, no.1
Control of the recrystallization at room temperature on fine cold-drawn copper wire by addition of a small amount of SnTakaaki Ichikawa; Tsutomu Takahashi; Hidetoshi Nagayama; Seigi Aoyama20002000, vol.39, no.1
Copper ion concentration cell corrosion and its prevention of C1220 heat pipeKozo Kawano; Tetsuro Atsumi; Takehiro Chinen20002000, vol.39, no.1
Copper sheet with excellent adhesion property to a resin layer by plating with blacked chromium compound layerYuichi Kanda; Takeshi Suzuki; Shin-ei Sato; Tetsuo Sato; Shigenari Ohtake; Seisho Miura20002000, vol.39, no.1
Cu-Sn-Ni-Zn base copper alloy with excellent stress relaxation resistance and bendabilityHirofumi Arai; Motohisa Miyafuji; Koya Nomura20002000, vol.39, no.1
Development of "KEEPALLOY", lead-free copper alloyKoichi Hagiwara; Masaru Yamazaki20002000, vol.39, no.1
Development of Cu-Cr in-situ compositeKuniteru Mihara; Yoshimasa Oyama; Hirowo G. Suzuki20002000, vol.39, no.1
Development of high strength Cu-Ni-Sn-(X) Cu alloysC. J. Kim; M. S. Kong; S. Z. Han; Y. C. Jung; S. B. Jung20002000, vol.39, no.1
Development of human and environment-friendly copper alloy "ECOBRASS" for machining, forging, and castingKeiichiro Oishi; Toshikazu Matsumoto; Takashi Okubo20002000, vol.39, no.1
Effect of intermetallic compound on oxidation of Cu-Ni-Si based alloysGlen M. Brown; Kenzo Kobayashi20002000, vol.39, no.1
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