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期刊


ISSN0020-2967
刊名Transactions of the Institute of Metal Finishing
参考译名金属精饰学会汇刊
收藏年代1998～2023



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2010, vol.88, no.1 2010, vol.88, no.2 2010, vol.88, no.3 2010, vol.88, no.4 2010, vol.88, no.5 2010, vol.88, no.6

题名作者出版年年卷期
Operating map - tool for plating functional layersW. Paatsch; G. Mollath20102010, vol.88, no.5
Recent advances in pulsed current electrodeposition: a brief reviewC. Larson; J. P. G. Farr20102010, vol.88, no.5
Pulse and pulse reverse plating of copper from acid sulphate solutionsP. Leisner; M. Fredenberg; I. Belov20102010, vol.88, no.5
Pulse plating of matt tin: effect on propertiesA. Vicenzo; S. Bonelli; P. L. Cavallotti20102010, vol.88, no.5
Corrosion properties of double layer nickel coatings obtained by pulse plating techniquesN. Imaz; E. Garcia-Lecina; J. A. Diez20102010, vol.88, no.5
Electroplating, electrode kinetics and electrocrystallisationJ. P. G. Farr20102010, vol.88, no.5
Periodic reverse current electrodeposited nickel pigmented anodised aluminiumM. Zemanova; P. Krivdova; J. Valtyni20102010, vol.88, no.5
Influence of additives and pulse parameters on uniformity of through-hole copper platingZ. X. Wang; S. Wang; Z. Yang; Z. L. Wang20102010, vol.88, no.5
Hydrogen embrittlement in electroplating: avoidance using pulse platingW. Paatsch20102010, vol.88, no.5



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