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期刊
ISSN
1345-9678
刊名
Materials Transactions
参考译名
材料汇刊
收藏年代
2003~2013
关联期刊
参考译名
收藏年代
Materials Transactions, JIM
日本金属学会材料汇刊
1998~2003
全部
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2004, vol.45, no.1
2004, vol.45, no.10
2004, vol.45, no.11
2004, vol.45, no.12
2004, vol.45, no.2
2004, vol.45, no.3
2004, vol.45, no.4
2004, vol.45, no.5
2004, vol.45, no.6
2004, vol.45, no.7
2004, vol.45, no.8
2004, vol.45, no.9
题名
作者
出版年
年卷期
Microstructure and Strength of Sn-Bi Coated Sn-3.5mass%Ag Solder Alloy
Jaesik Lee; Woongho Bang; Jaepil Jung; Kyuhwan Oh
2004
2004, vol.45, no.3
Eutectic Alloys in the Sn-Zn-Mg-Al System with Eutectic Temperature of 454 K
Masanori Inada; Masaki Kibe
2004
2004, vol.45, no.3
Influence of Noble Metal Coating on Wettability of Copper Substrate by Sn-Ag Eutectic Solder
Hisaaki Takao; Hideo Hasegawa
2004
2004, vol.45, no.3
Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga Alloys
Jenn-Ming Song; Nai-Shuo Liu; Kwang-Lung Lin
2004
2004, vol.45, no.3
IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging
Jeong-Won Yoon; Sang-Won Kim; Seung-Boo Jung
2004
2004, vol.45, no.3
Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM
Kyung-Seob Kim; Jun-Mo Yang; Chong-Hee Yu; Hyo-Joeng Jeon
2004
2004, vol.45, no.3
Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au Plating
Yousuke Sogo; Takashi Hojo; Hiroaki Iwanishi; Akio Hirose; Kojiro F. Kobayashi; Atsushi Yamaguch; Akio Furusawa; Kazuto Nishida
2004
2004, vol.45, no.3
The Effect of Reduction Capability of Resin Material on the Solder Wettability for Electrically Conductive Adhesives (ECAs) Assembly
Jong-Min Kim; Kiyokazu Yasuda; Masahiro Yasuda; Kozo Fujimoto
2004
2004, vol.45, no.3
Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder
Hiroshi Nishikawa; Tadashi Takemoto; Kouichi Kifune; Takashi Uetani; Norihisa Sekimori
2004
2004, vol.45, no.3
Application of Thermal Latent Carboxylic Acid Derivatives to Pb-Free Microsoldering
Shun Saito; Katumi Nakasato; Yukihiro Katoh; Yoshihiro Oshibe; Masahiro Ishidoya
2004
2004, vol.45, no.3
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