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期刊


ISSN1059-9495
刊名Journal of Materials Engineering and Performance
参考译名材料工程与特性杂志
收藏年代1998～2023



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2012, vol.21, no.1 2012, vol.21, no.10 2012, vol.21, no.11 2012, vol.21, no.12 2012, vol.21, no.2 2012, vol.21, no.3
2012, vol.21, no.4 2012, vol.21, no.5 2012, vol.21, no.6 2012, vol.21, no.7 2012, vol.21, no.8 2012, vol.21, no.9

题名作者出版年年卷期
Anisotropy of Wetting and Spreading in Binary Cu-Pb Metallic System: Experimental Facts and MD ModelingVadim Timoshenko; Vladimir Bochenkov; Vladimir Traskine; Pavel Protsenko20122012, vol.21, no.5
Thermophysical Properties of Liquid Silver-Bismuth-Tin AlloysYu. Plevachuk; V. Sklyarchuk; A. Yakymovych; P. Svec; D. Janickovic; E. Illekova20122012, vol.21, no.5
Interfacial Interactions Between W_xN Substrates and a Gold-Tin AlloyP. Descours; R. Voytovych; A. Garnier; F. Greco; F. Hodaj20122012, vol.21, no.5
Wetting of Sn-Zn-xIn (x = 0.5, 1.0, 1.5 wt%) Alloys on Cu and Ni SubstratesPrzemyslaw Fima; Tomasz Gancarz; Janusz Pstrus; Anna Sypien20122012, vol.21, no.5
Thermal Properties and Wetting Behavior of High Temperature Zn-Al-In SoldersTomasz Gancarz; Janusz Pstrus; Przemyslaw Fima; Sylwia Mosinska20122012, vol.21, no.5
Wetting of Cu and Al by Sn-Zn and Zn-Al Eutectic AlloysJanusz Pstrus; Przemyslaw Fima; Tomasz Gancarz20122012, vol.21, no.5
Effect of pH of Sulfate Solution on Electrochemical Behavior of Pb-Free Solder Candidates of SnZn and SnZnCu SystemsM. Grobelny; N. Sobczak20122012, vol.21, no.5
Relationship Between Mechanical Properties of Lead-Free Solders and Their Heat Treatment ParametersA. Klasik; N. Sobczak; K. Pietrzak; K. Makowska; A. Wojciechowski; A. Kudyba; E. Sienicki20122012, vol.21, no.5
Current Problems and Possible Solutions in High-Temperature Lead-Free SolderingAles Kroupa; Dag Andersson; Nick Hoo; Jeremy Pearce; Andrew Watson; Alan Dinsdale; Stuart Mucklejohn20122012, vol.21, no.5
Modeling of Reactive Diffusion: Mechanism and Kinetics of the Intermetallics Growth in Ag/Ag InterconnectionsR. Filipek; K. Szyszkiewicz; P. Dziembaj; P. Skrzyniarz; A. Wierzbicka-Miernik; P. Zieba20122012, vol.21, no.5
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