中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0957-4522
刊名Journal of Materials Science
参考译名材料科学杂志：电子材料
收藏年代1999～2013



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013

2010, vol.21, no.1 2010, vol.21, no.10 2010, vol.21, no.11 2010, vol.21, no.12 2010, vol.21, no.2 2010, vol.21, no.3
2010, vol.21, no.4 2010, vol.21, no.5 2010, vol.21, no.6 2010, vol.21, no.7 2010, vol.21, no.8 2010, vol.21, no.9

题名作者出版年年卷期
A review on the interfacial intermetallic compounds between Sn-Ag-Cu based solders and substratesGuang Zeng; Songbai Xue; Liang Zhang; Lili Gao; Wei Dai; Jiadong Luo20102010, vol.21, no.5
The effect of post-annealing under CdCl_2 atmosphere on the properties of ITO thin films deposited by DC magnetron sputteringShenghao Wang; Jingquan Zhang; Bo Wang; Lianghuan Feng; Yaping Cai; Lili Wu; Wei Li; Zhi Lei; Bing Li20102010, vol.21, no.5
InAs quantum dot superluminescent diodes with trench structureYoung Chae Yoo; Lee-Hyun Kim; Il Ki Han20102010, vol.21, no.5
Formation mechanism of NaNbO_3 powders during hydrothermal synthesisS. Y. Wu; W. Zhang; X. M. Chen20102010, vol.21, no.5
Dielectric and ferromagnetic properties of BaTiO_3/Ni_(0.93)Co_(0.02)Cu_(0.05)Fe_2O_4 compositesJiang li Chen; Zhuo Xu20102010, vol.21, no.5
Effects of Ag on microstructures, wettabilities of Sn-9Zn-xAg solders as well as mechanical properties of soldered jointsWen Xue Chen; Song Bai Xue; Hui Wang; Jian Xin Wang; Zong Jie Han; Li Li Gao20102010, vol.21, no.5
Investigation of microhardness and thermo-electrical properties in the Sn-Cu hypereutectic alloyE. Cadirli; U. Boyuk; S. Engin; H. Kaya; N. Marash; M. Ari20102010, vol.21, no.5
Analysis of weakly bonded oxygen in HfO_2/SiO_2/Si stacks by using HRBS and ARXPSTa-Chang Tien; Li-Chuan Lin; Lurng-Shehng Lee; Chi-Jen Hwang; Siddheswar Maikap; Yuri M. Shulga20102010, vol.21, no.5
Effect of oxygen to argon ratio on the properties of thin SiO_x films deposited by r.f. sputteringJ. M. Terrazas; N. Nedev; E. Manolov; B. Valdez; D. Nesheva; M. A. Curiel; R. Haasch; I. Petrov20102010, vol.21, no.5
Effect of silver nanostructures on the resistivity of electrically conductive adhesives composed of silver flakesDapeng Chen; Xueliang Qiao; Xiaolin Qiu; Fatang Tan; Jianguo Chen; Renzhi Jiang20102010, vol.21, no.5
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