中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0957-4522
刊名Journal of Materials Science
参考译名材料科学杂志：电子材料
收藏年代1999～2013



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013

2011, vol.22, no.1 2011, vol.22, no.10 2011, vol.22, no.11 2011, vol.22, no.12 2011, vol.22, no.2 2011, vol.22, no.3
2011, vol.22, no.4 2011, vol.22, no.5 2011, vol.22, no.6 2011, vol.22, no.7 2011, vol.22, no.8 2011, vol.22, no.9

题名作者出版年年卷期
Screening for counterfeit electronic partsBhanu Sood; Diganta Das; Michael Pecht20112011, vol.22, no.10
Failure localization with active and passive voltage contrast in FIB and SEMRuediger Rosenkranz20112011, vol.22, no.10
Innovative methodologies of circuit edit by focused ion beam (FIB) on wafer-level chip-scale-package (WLCSP) devicesTao-Chi Liu; Chih Chen; Shih-Ting Liu; Ming-Lun Chang; Jandel Lin20112011, vol.22, no.10
Two-photon absorption laser assisted device alteration using continuous wave 1,340 nm laserBaohua Niu; Patrick Pardy; Jerry Fortier; Mel Ortega; Travis Eiles20112011, vol.22, no.10
Characterization of poly-Si thin-film solar cell functions and parameters with IR optical interaction techniquesM. Boostandoost; F. Friedrich; U. Kerst; C. Boit; S. Gall; Y. Yokoyama20112011, vol.22, no.10
Extending acoustic microscopy for comprehensive failure analysis applicationsSebastian Brand; Peter Czurratis; Peter Hoffrogge; Dorota Temple; Dean Malta; Jason Reed; Matthias Petzold20112011, vol.22, no.10
LA ICP-MS in microelectronics failure analysisZixiao Pan; Wei Wei; Fuhe Li20112011, vol.22, no.10
Conductive filament formation in printed circuit boards: effects of reflow conditions and flame retardantsBhanu Sood; Michael Pecht20112011, vol.22, no.10
Disassembly methodology for conducting failure analysis on lithium-ion batteriesNick Williard; Bhanu Sood; Michael Osterman; Michael Pecht20112011, vol.22, no.10



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