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1340-2625
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まてりあ
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1999, vol.38, no.1
1999, vol.38, no.10
1999, vol.38, no.11
1999, vol.38, no.12
1999, vol.38, no.2
1999, vol.38, no.3
1999, vol.38, no.4
1999, vol.38, no.5
1999, vol.38, no.6
1999, vol.38, no.7
1999, vol.38, no.8
1999, vol.38, no.9
题名
作者
出版年
年卷期
Analyses of microstructure evolutions during reverse phase transformations in alloyed steels using calculated phase diagrams
Dmitry V. Shtansky
1999
1999, vol.38, no.12
Current status of R&D project of lead-free solders
Tadatomo Suga
1999
1999, vol.38, no.12
Development of lead-free soldering and establishment of new product
Kenichiro Suetsugu
1999
1999, vol.38, no.12
Development of plating for lead-free solder joint
Susumu Arai; Naoyuki Shinohara; Norio Kaneko
1999
1999, vol.38, no.12
Electrical reliability on the degradation due to electrochemical migration for PCBs
Tsutomu Tsukui
1999
1999, vol.38, no.12
Evaluation of solder alloy characteristics by a strain rate changing tensile test
Tadashi Takemoto
1999
1999, vol.38, no.12
Fatigue characteristics of lead-free solder alloys
Yoshiharu Kariya; Masahisa Otsuka
1999
1999, vol.38, no.12
Improved design life and environmentally aware manufacturing of electronics assemblies by lead-free soldering
James H. Vincent
1999
1999, vol.38, no.12
Lead free solder development in computer and communication equipment
Eiichi Kono
1999
1999, vol.38, no.12
Lift-off phenomenon in tin binary alloys
Hisaaki Takao; Hideo Hasegawa
1999
1999, vol.38, no.12
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