中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
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1995, vol.117, no.1 1995, vol.117, no.2 1995, vol.117, no.3 1995, vol.117, no.4

题名作者出版年年卷期
The mechanics of the edge delamination testBoris Mirman19951995, vol.117, no.4
Simulation of heat transfer in a reflow soldering oven with air and nitrogen injectionY. S. Son; T. L. Bergman; M. T. Hyun19951995, vol.117, no.4
Review of heat transfer technologies in electronic equipmentL. T. Yeh19951995, vol.117, no.4
Optima; chip layout on a printed circuit board using design sensitivity analysis of subdomain configurationSeo Jin Joo; Byung Man Kwak19951995, vol.117, no.4
Natural convection in shallow, horizontal air layers encountered in electronic coolingElias Papanicolaou; Sridhar Gopalakrishna19951995, vol.117, no.4
Integrated infrared failure analysis of printed circuit boardsJ. J. Miles; C. R. Zelak; J. M. Kliman; J. E. Sunderland19951995, vol.117, no.4
Effect of wall conduction on natural convection in an enclosure with a centered heat sourceYi-Hsiang Huang; Suresh K. Aggarwal19951995, vol.117, no.4
Computations for a three-by-three array of protrusions cooled by liquid immersion: effect of substrate thermal conductivityD. Mukutmoni; Y. K. Joshi; M. D. Kelleher19951995, vol.117, no.4
Comparison of two-phase electronic cooling using free jets and spraysKurt A. Estes; Issam Mudawar19951995, vol.117, no.4
Cleaning and reflow of Pb-Sn C4 solder bumpsCaroline S. Lee; Doug C. Crafts; T. W. Eagar19951995, vol.117, no.4
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