中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023

2014, vol.136, no.1 2014, vol.136, no.2 2014, vol.136, no.3 2014, vol.136, no.4

题名作者出版年年卷期
Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile ApplicationsMirza, Fahad; Naware, Gaurang; Jain, Ankur; Agonafer, Dereje20142014, vol.136, no.4
Design and Control of the IBM Power 775 Supercomputer Water Conditioning UnitEllsworth, Michael J., Jr.; Zoodsma, Randy J.; Cascio, Frank; Behrendt, Eileen20142014, vol.136, no.4
UCPD Model for Pb-Free SolderNeilsen, Michael K.; Vianco, Paul T.20142014, vol.136, no.4
Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded ElectrodesTaylor, Stephen H.; Garimella, Suresh V.20142014, vol.136, no.4
Performance Analysis of a Combination System of Concentrating Photovoltaic/Thermal Collector and Thermoelectric GeneratorsXu, Xinqiang; Zhou, Siyi; Meyers, Mark M.; Sammakia, Bahgat G.; Murray, Bruce T.20142014, vol.136, no.4
Advanced Natural Convection Cooling Designs for Light-Emitting Diode Bulb SystemsPetroski, James20142014, vol.136, no.4
Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal FoamsShirazy, Mahmood R. S.; Frechette, Luc G.20142014, vol.136, no.4
Strain Transfer Analysis of Integrated Surface Acoustic Wave SensorsHempel, Jochen; Anees, Sohaib; Zukowski, Elena; Berndt, Michael; Wilde, Juergen; Reindl, Leonhard M.20142014, vol.136, no.4
Design of Thermoelectric Modules for High Heat Flux CoolingRanjan, Ram; Turney, Joseph E.; Lents, Charles E.; Faustino, Virginia H.20142014, vol.136, no.4
Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit IntegrationLau, John H.20142014, vol.136, no.4
12345678



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  机械工业信息研究院 2018-2024