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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2022, vol.144, no.1 2022, vol.144, no.2 2022, vol.144, no.3 2022, vol.144, no.4

题名作者出版年年卷期
Optimized Design of Various Ag Decorated Sn-xAg-Cu-0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale PackagingLee, H. T.; Ho, C. Y.; Lee, C. C.20222022, vol.144, no.4
Coupled Calculations of Data Center Cooling and Power Distribution SystemsWemhoff, Aaron P.; Ahmed, Faisal20222022, vol.144, no.4
Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image CorrelationLyons, Sara K.; Chandramohan, Aditya; Weibel, Justin A.; Garimella, Suresh, V20222022, vol.144, no.4
Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending DeformationsKim, Tae-Wook; Kim, Jae-Min; Yun, Hyeon-Ji; Lee, Jong-Sung; Lee, Jae-Hak; Song, Jun-Yeob; Joo, Young-Chang; Lee, Won-Jun; Kim, Byoung-Joon20222022, vol.144, no.4
Fracture Behavior and Reliability of Low-Silver Lead-Free Solder JointsSharma, Ved Prakash; Datla, Naresh Varma20222022, vol.144, no.4
Influence of Laser Soldering Temperatures on Through-Hole ComponentZahiri, Saifulmajdy A.; Abas, Aizat; Sharif, M. F. M.; Ani, Fakhrozi Che20222022, vol.144, no.4
A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip PackagingYao, Xingjun; Jiang, Weijie; Yang, Jiahui; Fang, Junjie; Zhang, Wenjun20222022, vol.144, no.4
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of ElectronicsTong, Wei; Ganjali, Alireza; Ghaffari, Omidreza; al Sayed, Chady; Frechette, Luc; Sylvestre, Julien20222022, vol.144, no.4
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental VerificationMohsenian, Ghazal; Hoang, Cong Hiep; Nemati, Kourosh; Alissa, Hussam; Tradat, Mohammad; Fallahtafti, Najmeh; Radmard, Vahideh; Murray, Bruce; Sammakia, Bahgat20222022, vol.144, no.4
Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical ReviewEmir, Tolga; Ourabi, Hamza; Budakli, Mete; Arik, Mehmet20222022, vol.144, no.4
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