中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2014, vol.136, no.1 2014, vol.136, no.2 2014, vol.136, no.3 2014, vol.136, no.4

题名作者出版年年卷期
Thermal Performance of a Water-Cooled Microchannel Heat Sink With Grooves and ObstaclesYonghui Xie; Zhongyang Shen; Di Zhang; Jibing Lan20142014, vol.136, no.2
Thermal-Aware Microchannel Cooling of Multicore Processors: A Three-Stage Design ApproachYubai Li; Dongzhi Guo; Shi-Chune Yao20142014, vol.136, no.2
Thermal Management of Time-Varying High Heat Flux Electronic DevicesT. David; D. Mendler; A. Mosyak; A. Bar-Cohen; G. Hetsroni20142014, vol.136, no.2
Development of a Mini Heat Sink Model With Homogeneous Heat Transfer CapabilityJ. F. Zhou20142014, vol.136, no.2
An Experimental Study on Heat Transfer Enhancement of Non-Newtonian Fluid in a Rectangular Channel With Dimples/ProtrusionsDi Zhang; Lu Zheng; Gongnan Xie; Yonghui Xie20142014, vol.136, no.2
Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip StacksYassir Madhour; Brian P. d'Entremont; Jackson Braz Marcinichen; Bruno Michel; John Richard Thome20142014, vol.136, no.2
Variable Fin Density Flow Channels for Effective Cooling and Mitigation of Temperature Nonuniformity in Three-Dimensional Integrated CircuitsDaniel Lorenzini-Gutierrez; Satish G. Kandlikar20142014, vol.136, no.2
Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power DistributionJun Jie Liu; Hua Zhang; S. C. Yao; Yubai Li20142014, vol.136, no.2
Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated CircuitsSatish G. Kandlikar20142014, vol.136, no.2
Advances in the Fabrication Processes and Applications of Wafer Level PackagingPeisheng Liu; Jinlan Wang; Liangyu Tong; Yujuan Tao20142014, vol.136, no.2
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